Description
L860-GL module
Specifications:
Note:
not for Thinkpad laptop
x Chipset: XMM7560
x LTE FDD:LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 21, 25, 26, 28, 29, 30, 32, 66
x LTE TDD: B38/39/40/41/42
x UMTS: Band 1, 2, 4, 5, 8
x Form factor: M.2 package
x Dimensions: 30.0 x 42.0 x 2.3 mm
x DL 5CA on 4 bands, DL 256QAM support
x DL-MIMO: 2 x 2, 4 x 2, 4 x 4
x DL 4×4 MIMO: Band 1,2,3,4,7,30,40,41NB, 66
x LAABand 46
x Integrated GNSS
x eSIM interface support
x Operating Voltage: 3.135V~4.4V, Typical 3.3V
x Operating Temperature: -10~+55°C
x Storage Temperature: -40~+85°C
x AT Command Set: 3GPP TS 27.007 and 27.005, proprietary FIBOCOM AT commands
x TX Power:
– FDD& TDD LTE: 23dBm
– WCDMA: 23.5dBm
x RX Sensitivity: FDD& TDD LTE: -98dBm~102dBm
x Data
– FDD& TDD LTE: 1Gbps DLCat 16, 150Mbps
– ULCat 13, 2CA on intra bands
– UMTS/HSPA+: 42Mbps DLCat 24, 11.5Mbps
– ULCat 7
x Interface
– USIM: 3V/1.8V
– PCIe
– BodySar
x Driver: Windows 10 and Linux
Package include: 1 x Card
